We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Bonding Equipment.
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Bonding Equipment Product List and Ranking from 9 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Bonding Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. ファインテック日本 Tokyo//Industrial Electrical Equipment
  2. Shinwa Co., Ltd. Mechatronics System Center Aichi//Industrial Machinery
  3. Micro Point Pro ltd 本社 Tokyo//Electronic Components and Semiconductors
  4. 4 アイテス Shiga//Electronic Components and Semiconductors
  5. 5 オルテコーポレーション 本社 Kyoto//Electronic Components and Semiconductors
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Bonding Equipment Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Instantly peel off adhesive with light! Clean and fast temporary bonding and debonding process. Shinwa Co., Ltd. Mechatronics System Center
  2. Regarding the bonding interface of Cu wire bonding. アイテス
  3. Tabletop Manual Wire Bonder "IBOND5000" Micro Point Pro ltd 本社
  4. Technical Data: Laser-Assisted Die Bonding ファインテック日本
  5. 5 Useful for semiconductor backend processes! Design pickup tools in any format. オルテコーポレーション 本社

Bonding Equipment Product List

1～15 item / All 29 items

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Regarding the bonding interface of Cu wire bonding.

Regarding the bonding interface of Cu wire bonding.

We introduce the features of Cu wire bonding and the selection of cross-section preparation methods!

This document explains the bonding interface of Cu wire bonding in semiconductor packages. It details the purpose and wire bonding, as well as the characteristics of Cu wire bonding, the Cu-Al compounds at the bonding center, micro voids, and the growth (diffusion) of Cu-Al compounds, accompanied by diagrams and photographs. [Contents (excerpt)] ■ Purpose and wire bonding ■ Samples and methods ■ Procedures and flow ■ Characteristics of Cu wire bonding ■ Selection of cross-section preparation methods *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • Other electronic parts

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[Application Example] 3D Mounting with High-Precision Die Bonder

[Application Example] 3D Mounting with High-Precision Die Bonder

Submicron positional accuracy! High bonding load up to 1000N!

In the development of electronic devices, there is a constant demand for increased speed, higher density, and optimization of device size and functional integration. Recent technological trends have made it a critical issue to incorporate three-dimensional stacked structures into the implementation of microprocessors, memory, image sensors, and IR sensors. In response to various demands such as the reduction of pitch size, the need for miniaturization of devices, and the pursuit of thermal and electrical mechanical stability, optimization of internal wiring is required. To accommodate the increasing number of bumps, miniaturization of pitch size, and demands for reduced device height, high-precision die bonders and flip chip bonders that guarantee large bonding loads and extensive flatness are needed.

  • Bonding Equipment

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[Use Case] Implementation and Packaging of Optical Communication Devices

[Use Case] Implementation and Packaging of Optical Communication Devices

From prototype development to mass production! Ensuring high yield with manufacturing technology.

Fine Tech specializes in the manufacturing of high-precision die bonding equipment and is constantly pursuing cutting-edge technology. With its innovative know-how, it supports the mounting of fine components. The "FINEPLACER series" allows for flexible addition of bonding processes to manual, semi-automatic, and fully automatic machines, thanks to its modular structure, which is the basic concept of the equipment. The multi-purpose die bonding equipment offers configurations ranging from small-scale production at the prototype research and development level to fully automatic models that cater to production phases with high yield. 【Features】 ■ Mounting accuracy of 0.5μm ■ Based on the technology of the "FINEPLACER series" ■ Easy process transfer ■ Verification of rare processes ■ High-precision mounting facilitates rapid process establishment *For more details, please refer to the PDF document or feel free to contact us.

  • Bonding Equipment
  • others

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Technical Data: Bonding Technology for 3D Packaging

Technical Data: Bonding Technology for 3D Packaging

Evaluation Report on 3D Packaging Technology Using the High-Precision Die Bonding Device "FINEPLACER sigma"

This document introduces various bonding methods used in 3D packaging. As a result of extensive prototype research, various chips with a high number of bumps (up to 143,000), narrow pitch widths (minimum 25μm), and small bump diameters (minimum 13μm) were mounted on substrates using the high-precision die bonder "FINEPLACER sigma." It presents experimental methods related to 3D packaging technology, the process parameters used, and the results obtained. [Contents (excerpt)] ■ Metal diffusion (MD) bonding, transient liquid phase bonding (TLPB) ■ Thermal compression bonding using pre-underfill ■ Liquid-solid diffusion bonding (SLID) ■ Thermal compression bonding ■ Eutectic bonding ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

  • Other mounting machines

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Technical Data: Flip Chip Bonding to Organic Substrates

Technical Data: Flip Chip Bonding to Organic Substrates

Description of the characteristic evaluation of micro-implementation technology! It includes experimental results and discussions.

This document describes the characteristic evaluation of micro-assembly technologies utilized in manufacturing techniques such as anisotropic adhesive bonding, ultrasonic mounting, thermal combined ultrasonic mounting, and solder mounting. It includes an overview of flip chip bonding technology, as well as experimental results and discussions. A custom flip chip bonding technology inspired by solder bump technology was also experimentally validated. 【Contents】 ■ Introduction ■ Overview of Flip Chip Bonding Technology ■ Experimental Results and Discussion ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

  • Other mounting machines

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[Blog] Joining Materials and Joining Methods

[Blog] Joining Materials and Joining Methods

We realize that our Daibonder has very high versatility! An explanation of bonding materials and bonding methods.

It is always interesting to learn about the chemicals used by customers in bonding technology. There are many factors to consider. Due to the diversity and characteristics of materials, such as low viscosity, high viscosity, and thixotropic media, it is necessary to take multiple parameters into account when selecting materials suitable for the application. Even more importantly, it is essential to invest in equipment that can build a profile that allows for a phased bonding process and ensures a seamless roadmap to the production process. Here, Finetech can make an impact on your research and development. In this blog, we introduce "bonding materials and bonding methods." *For more details, you can view the PDF materials. Please feel free to contact us for more information.*

  • Other mounting machines

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[Blog] Is rework a mature technology?

[Blog] Is rework a mature technology?

Here is how to determine which technology is suitable for your needs.

Fine Tech has been a company specializing in SMT rework and repair equipment since its founding over 25 years ago. Interestingly, the machine we first manufactured and continue to sell today has a placement accuracy of ±10μm. That said, now that 25 years have passed, the question posed in the title of this blog is indeed very valid. There are many rework systems on the market, including those with optical systems, those without, devices that use infrared as a heat source, and convection devices, among various types. In this blog, we discuss the topic, "Is rework a mature technology?" *For more details, you can view the content in the PDF document. Please feel free to contact us for more information.

  • Other mounting machines

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[Blog] Micro Assembly Day 2018

[Blog] Micro Assembly Day 2018

I learned about the tremendous efforts towards the reconstruction of the world-famous Berlin City Hall!

On May 17, 2018, approximately 50 European professionals from industry and academia participated in Fine Tech's Micro Assembly Day 2018. This one-day conference, held annually in Berlin, was organized to facilitate active knowledge sharing and experience exchange regarding new trends in high-precision packaging and micro assembly. In this blog, we introduce "Micro Assembly Day 2018 a Success." *For more detailed information, please refer to the PDF document. Feel free to contact us for more details.*

  • Other mounting machines
  • Other embedded systems (software and hardware)

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[Blog] A Few "Little Things" Related to SMTAi 2018

[Blog] A Few "Little Things" Related to SMTAi 2018

We are able to quickly provide solutions for the newly emerging microLED market!

I was invited to a session on rework and presented on the rework methods for highly miniaturized SMT components such as micro LEDs. Finetech has long been a company that provides complete solutions for microchip rework, but it seems that the definitions of "micro" and "small" have been changing year by year. In this blog, I will introduce some "small things" related to SMTAi 2018. *For more details, you can view the PDF materials. Please feel free to contact us for more information.

  • Other mounting machines

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Technical Data: Laser Bonding

Technical Data: Laser Bonding

This document contains technical information about laser bar bonding!

The semiconductor laser diode bar is used as an excitation light source for optical resonators in solid-state lasers and gas lasers, as well as in other fields such as medical devices and material processing. In the assembly process, alignment and bonding to the sub-carrier, as well as bonding to special heat sinks for sub-assemblies, are performed. This document describes the challenges related to the assembly of laser diode bars, common error cases, and Fine Tech's approach as a solution to ensure the success of the process. *For more details, please refer to the PDF document or feel free to contact us.*

  • Other semiconductor manufacturing equipment

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Instantly peel off adhesive with light! Clean and fast temporary bonding and debonding process.

Instantly peel off adhesive with light! Clean and fast temporary bonding and debonding process.

Ultra-fast, clean, and low-load. Why not optimize the TBDB (temporary bonding and debonding) process with a photonic debonding device?

We introduce a photonic debonding device that accelerates the peeling process from temporary bonding, starting with semiconductor manufacturing processes. This device converts light into heat and achieves fast and clean debonding through unique technology. Since it does not apply stress to the device, it meets various debonding needs, including delicate devices like thin wafers. 【Main Benefits】 ▶ Capable of irradiating and debonding a wide area at once, suitable for large substrates ▶ No ash generation, simplifying the cleaning process ▶ Limited heat transfer to the device, almost no stress ▶ Reusable carrier ▶ Easy maintenance If you are interested in usage images or actual application examples, please take a look at the materials.

  • Other semiconductor manufacturing equipment

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Manual and Automatic Bonding Device 'BJ653'

Manual and Automatic Bonding Device 'BJ653'

Bond head replacement completed in a few minutes! Compatible with ball bonding, fine wire, and thick wire, etc.

The BJ653 applies highly reliable Hesse quality and is suitable for product samples, prototype production, and small-scale manufacturing. The bond head of this product is interchangeable and supports wedge bonding, ball bonding, fine wires, thick wires, and ribbons. It accommodates both manual and automatic bonding, making it particularly suitable for quality verification in research and development, as well as in the prototype stage of products. 【Features (partial)】 ■ Bond head options compatible with commonly available wire materials ■ Use of friction-free components with piezo technology ■ Maintenance-free fresher hinge ■ Work area: X100mm, Y90mm, Z50mm ■ Optimized pattern recognition *For more details, please refer to the PDF document or feel free to contact us.

  • Bonding Equipment

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[Use Case] High-precision assembly due to high optical resolution

[Use Case] High-precision assembly due to high optical resolution

Achieved an optical resolution of 0.7µm!

In the implementation of optical devices such as VCSELs and PDs, the alignment target is an aperture with a diameter of only 7 micrometers. Achieving high-precision alignment of this within a millimeter-scale field of view is extremely challenging.

  • Bonding Equipment

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[Blog] Speed vs Throughput

[Blog] Speed vs Throughput

Two important variables to consider when choosing a device are speed and throughput!

In the world of contract manufacturing, we must consider the projects that may come in at any time. Therefore, to determine what kind of equipment to purchase, it is necessary to take into account many variables (factors). To ensure that contract manufacturers can produce high-quality products while competing, a suitable set of production equipment is required. In the world of contract manufacturing, it is not uncommon to handle dozens of products, ranging from small-scale items with fewer than 100 units to mass production. In the case of OEM, there may be a need to assemble thousands of products. This blog introduces the topic of "Speed vs Throughput." *For more detailed information, you can view the PDF materials. Please feel free to contact us for more details.*

  • Other mounting machines

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[Blog] Patience Due to COVID-19

[Blog] Patience Due to COVID-19

While sincerely acknowledging this situation, we continue to improve our business!

The word that may be suitable to describe the year 2020 is "Perseverance." Of course, this word applies not only to the dedicated employees of Fintech but to the entire world. Extraordinary sacrifices have been made for a greater cause, and it is not over yet. There have certainly been mistakes and lessons to learn. However, many people must have done what they believed to be right. Our Fintech offices around the world have endured shutdowns in regions including China, Malaysia, Japan, Europe, and the United States. Yet, while sincerely acknowledging this situation, our business continues to improve. In this blog, we discuss "Perseverance during COVID-19." *For more details, you can view the PDF materials. Please feel free to contact us for more information.*

  • Other services

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